发明名称 Resist and etching by-product removing compositionand resist removing using the same
摘要 A resist removing composition having a superior capability for removing a resist, polymer, organometallic polymer and etching by-products such as metal oxide, which does not attack underlying layers exposed to the composition and which does not leave residues after a rinsing step. The resist removing composition contains alkoxy N-hydroxyalkyl alkanamide and a swelling agent.
申请公布号 SG128421(A1) 申请公布日期 2007.01.30
申请号 SG20020001673 申请日期 2002.03.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK DONG-JIN;KIM KYUNG-DAE;CHON SANG-MUN;HWANG JIN-HO;SOHN IL-HYUN;PARK SANG-OH;JUN PIL-KWON
分类号 G03F7/32;C11D1/52;C11D7/26;C11D7/32;C11D7/34;C11D7/50;C11D7/60;C11D11/00;G03F7/42;H01L21/027;H01L21/3065 主分类号 G03F7/32
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