| 摘要 |
In a pressure-sensitive adhesive sheet 1 that comprises a base material 11 and a pressure-sensitive adhesive layer 12, and has formed therein by thermal processing a plurality of through holes 2 passing through one surface to the other surface of the pressure-sensitive adhesive sheet 1, as the base material 11, one is used for which, upon heating at a heating rate of 20° C./min under a nitrogen atmosphere, the temperature at a thermal decomposition peak where the mass reduction is greatest is not more than 450° C., or the difference between the temperature at the thermal decomposition peak and the temperature at a melting peak is not more than 250° C. According to this pressure-sensitive adhesive sheet 1, the appearance of the pressure-sensitive adhesive sheet 1 is not marred by the through holes 2 formed by the thermal processing. |
