METHOD FOR BONDING WORK PIECES AND MICRO-STRUCTURED COMPONENT
摘要
<p>For forming very strong bond joints suited for manufacturing micro-structured components consisting of a plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.</p>
申请公布号
WO2007006461(A1)
申请公布日期
2007.01.18
申请号
WO2006EP06534
申请日期
2006.06.28
申请人
ATOTEC DEUTSCHLAND GMBH;MEYER, HEINRICH;KURTZ, OLAF;HERBER, RALPH;MADRY, CHRISTIAN;ETZKORN, JOHANNES;VAGO, THOMAS
发明人
MEYER, HEINRICH;KURTZ, OLAF;HERBER, RALPH;MADRY, CHRISTIAN;ETZKORN, JOHANNES;VAGO, THOMAS