摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment copper foil which has a smooth surface and proper adhesion with polyimide, and to provide its manufacturing method. SOLUTION: In the copper foil for a printed wiring, at least a surface in contact with a resin has an Fe alloy layer in a copper and copper alloy foil, whose surface roughness Rz<SB>JIS</SB>(JIS B 0601(2001)) is 2.0μm or less, and Cr exists in the surface. The Fe alloy is an alloy with one kind or two or more kinds of Cr, Ni and Co. COPYRIGHT: (C)2007,JPO&INPIT
|