发明名称 COPPER FOIL FOR PRINTED WIRING
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment copper foil which has a smooth surface and proper adhesion with polyimide, and to provide its manufacturing method. SOLUTION: In the copper foil for a printed wiring, at least a surface in contact with a resin has an Fe alloy layer in a copper and copper alloy foil, whose surface roughness Rz<SB>JIS</SB>(JIS B 0601(2001)) is 2.0μm or less, and Cr exists in the surface. The Fe alloy is an alloy with one kind or two or more kinds of Cr, Ni and Co. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007012940(A) 申请公布日期 2007.01.18
申请号 JP20050193046 申请日期 2005.06.30
申请人 NIKKO KINZOKU KK 发明人 MURATA MASATERU;SENKAWA TOMOHIRO
分类号 H05K1/09;B32B15/04 主分类号 H05K1/09
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