| 摘要 |
Reflow soldering of a variety of circuit boards ( 9, 11, 15 ) in a variety of sizes and shapes to assigned locations on the base or carrier ( 13 ) of the electronic module housing ( 3 ) is simplified by eliminating custom made metal blocks previously used to clamp the circuit boards against the carrier metal. Instead, the solder-backed circuit boards are placed in assigned positions in the module housing and the inside volume of that housing is filled ( 22 ) with particulate, such as small beads ( 17 ), covering the circuit boards, but leaving the edges of the upstanding metal shields ( 5 and 7 ) visible. A plate ( 21 ) backed foam sheet ( 19 ) is placed over the module housing ( 24 ) and clamped down ( 26 ), pressing against the beads. The clamped assembly is then heated ( 28 ) to reflow the solder, soldering the circuit boards in place.
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