发明名称 |
MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE |
摘要 |
<p>A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.</p> |
申请公布号 |
WO2007005275(A1) |
申请公布日期 |
2007.01.11 |
申请号 |
WO2006US23957 |
申请日期 |
2006.06.20 |
申请人 |
GENERAL ELECTRIC COMPANY;LU, QIWEI;O'BRIEN, MICHAEL;ROCHA-GALICIA, GERARDO;SUSARLA, PRAMEELA |
发明人 |
LU, QIWEI;O'BRIEN, MICHAEL;ROCHA-GALICIA, GERARDO;SUSARLA, PRAMEELA |
分类号 |
C08L63/00;C08K3/36;C08L71/12;H01L23/29 |
主分类号 |
C08L63/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|