| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic part package that can convey heat efficiently. <P>SOLUTION: A bonding agent 26 comprises materials containing In and Ag of 3 weight% or more. The inventor of this bond has found that, as the percent of Ag to the total weight of the bonding agent 26 increases, the quantity of voids in junctions to an electronic part 21 and a thermal conduction material 15 decreases in the bonding agent 26. In addition, In-Ag has a thermal resistance value smaller than conventional solder materials like Sn-Pb, and its thermal conductance is better than that of the conventional solder materials. As a result, this bonding agent 26 enables the heat of the electronic part 21 to the thermal conduction material 15 more efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT |
