发明名称 PRESSING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To simplify the structure of a parallelism adjustment portion and to evenly press a first object against a second object under a state that the parallelism between a first abutting region of the first object and a second abutting region of the second object is precisely adjusted. SOLUTION: In the pressing apparatus, the parallelism adjustment portion 32 of a substrate joining device 1 comprises a central portion 321 connected to a first holding portion 31 for holding a first substrate 91, a peripheral portion 322 connected to an installation portion 33, and flexible connecting portions 323 for connecting the central portion 321 and the peripheral portion 322. In the substrate joining device 1, the connecting portions 323 bend when the first substrate 91 is pressed against a second substrate 92, so the bottom face 911 of the first substrate 91 follows the top face 921 of the second substrate 92. Therefore, the structure of the parallelism adjustment portion 32 can be simplified, and the first substrate 91 can be evenly pressed against the second substrate 92, with the parallelism between the bottom face 911 of the first substrate 91 and the top face 921 of the second substrate 92 being precisely adjusted. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007005577(A) 申请公布日期 2007.01.11
申请号 JP20050184298 申请日期 2005.06.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MAEKAWA YUKIHIRO;AZUMA KAZUJI;ISHITANI SHINJI
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项
地址