发明名称 |
METHOD OF ELIMINATING CURL FOR DEVICES ON THIN FLEXIBLE SUBSTRATES, AND DEVICES MADE THEREBY |
摘要 |
A thin film semiconductor device such as a photovoltaic device is fabricated on a lightweight substrate material which is affixed to a layer of material which is in turn supported by a carrier. Following the fabrication of the device, the carrier is removed such as by an etching process, leaving the layer of material adhered to the substrate. The adhered layer provides a balancing force to the back side of the substrate which minimizes or eliminates the tendency of the semiconductor device supported on the opposite side of the substrate to cause the substrate to curl. Also disclosed are devices and structures made by this method. |
申请公布号 |
WO2006081315(A3) |
申请公布日期 |
2007.01.11 |
申请号 |
WO2006US02689 |
申请日期 |
2006.01.26 |
申请人 |
UNITED SOLAR OVONIC CORPORATION;BEERNINK, KEVIN |
发明人 |
BEERNINK, KEVIN |
分类号 |
H01L31/00 |
主分类号 |
H01L31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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