发明名称 INSPECTION METHOD OF PRINTED CIRCUIT BOARD
摘要 A method for inspecting a printed circuit board is provided to measure a voltage quantity generated from each unit of a check substrate by directly contacting the check substrate having a piezoelectric ceramic element with a surface of the printed circuit board. A method for inspecting a printed circuit board includes the steps of: preparing a check apparatus including a check substrate, which has lattice type units, a voltage output unit, which receives a signal generated from each unit, an image generation unit, which generates image output in response to each unit of the voltage output unit, and an error determination unit, which determines an error of the image of the image generation unit in response to each unit by checking an image of the image generation unit; arranging the check substrate on a surface of a printed circuit board which is fill-plated(280); pressing the check substrate with a regular pressure(282); transferring a voltage generated from each unit to the voltage output unit by the pressure(284); at the image generation unit, generating an image in response to the surface of the printed circuit board based on a voltage value of each unit(286); and at the error determination unit, determining a fill-plating part of the printed circuit board in response to the unit based on the image(288).
申请公布号 KR20070002488(A) 申请公布日期 2007.01.05
申请号 KR20050058047 申请日期 2005.06.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK, KYUNG TAE;KIM, KEUN HO;JUNG, JAE YOUB
分类号 H05K13/08 主分类号 H05K13/08
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