发明名称 Embedded thin layer capacitor, layered structure, and fabrication method of the same
摘要 The present invention relates to a thin layer capacitor including first and second metal electrode layers and a dielectric layer of BiZnNb-based amorphous metal oxide having a dielectric constant of at least 15, interposed between the metal layers, and a layered structure having the same. The layered structure includes a first metal electrode layer formed on a polymer-based composite substrate, a dielectric layer, formed on the first metal electrode layer, and made of BiZnNb-based metal oxide with a dielectric constant of at least 15, and a second metal electrode layer formed on the dielectric layer. The BiZnNb-based amorphous metal oxide in this invention has a high dielectric constant without a thermal treatment for crystallization, useful for fabrication of a thin layer capacitor of a polymer-based layered structure such as a PCB.
申请公布号 US2007004165(A1) 申请公布日期 2007.01.04
申请号 US20050319820 申请日期 2005.12.28
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN HYO S.;YOON SOON G.;PARK EUN T.;LYOO SOO H.
分类号 H01L21/20 主分类号 H01L21/20
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