| 摘要 |
A light emitting diode(LED) is provided to reduce the difference of thermal expansion coefficient between the LED body and a light emitting chip by forming a buffer layer between the LED body and the light emitting chip. A light emitting diode includes a body, a buffer layer(120) formed on the body, light emitting chip(140) packaged on the buffer layer and molding part(200) surrounding the light emitting chip. A value of the buffer layer's thermal expansion coefficient is between the LED body's thermal expansion coefficient and the light emitting chip's s thermal expansion coefficient. And the body is which one of a housing, a board, a metal slug fixed on the housing or a lead frame, the buffer layer is a form of the multiple layers so that the thermal expansion coefficient changes by degrees.
|
