Electrical connection arrangement, for e.g. integrated circuit, has metallic layer arranged on surfaces of internal contact terminal and wire, where terminal is connected to external terminal of contact device by wire

摘要

The arrangement has a metallic layer (7) applied before producing an electrical connection between a semiconductor circuit arrangement (1) and an external contact device (3). The metallic layer is arranged on a surface of an internal contact terminal (4) and on a surface of a wire (6). A bottom of the semiconductor circuit arrangement and a top side of the external contact device are placed opposite to one another. The internal contact terminal is connected to an external contact terminal (5) of the external contact device by the wire. An independent claim is also included for a method for producing a connection arrangement.