发明名称 Substrate processing system and substrate processing method
摘要 <p>A substrate processing system 100 and a substrate processing method process a plurality of substrates in a single-substrate processing mode by the cooperative operation of a first processing system and a second processing system. The substrate processing system 100 suppresses increase in cost and footprint and the reduction of yield and throughput. The substrate processing system 100 includes a first processing system 50 for processing substrates in a single-substrate processing mode and a second processing system 60 for processing substrates in a single-substrate processing mode. The second processing system 60 processes a substrate processed by a first process by the first processing system 50 by a second process, and the first processing system processes the substrate processed by the second process by the second processing system 60 by a third process. The first processing system 50 includes a first control means 30 for controlling a substrate carrying operation. The second processing system 60 includes a second control means 40. The first control means 30 (or the second control means 40) obtains information about processing time needed by the second processing system 60 (the first processing system 50) and controls a substrate carrying operation for carrying substrates between the first processing system 50 and the second processing system 60 on the basis of the obtained information.</p>
申请公布号 EP1737022(A1) 申请公布日期 2006.12.27
申请号 EP20060011214 申请日期 2006.05.31
申请人 TOKYO ELECTRON LIMITED 发明人 KANEKO, TOMOHIRO;MIYATA, AKIRA
分类号 H01L21/00;G03F7/20;G06F19/00;H01L21/027 主分类号 H01L21/00
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