发明名称 |
Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
摘要 |
A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
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申请公布号 |
US7150673(B2) |
申请公布日期 |
2006.12.19 |
申请号 |
US20050176184 |
申请日期 |
2005.07.08 |
申请人 |
EBARA CORPORATION |
发明人 |
SAKURAI KUNIHIKO;TOGAWA TETSUJI;MOCHIZUKI YOSHIHIRO;FUKUDA AKIRA;HIYAMA HIROKUNI;HIROKAWA KAZUTO;TSUJIMURA MANABU |
分类号 |
B24B37/04;B24B49/00;G06F19/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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