| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor that can be miniaturized, without losing pressure measurement precision and connection reliability, while a pressure-sensitive chip is connected to electronic equipment for measurement, using bumps. SOLUTION: The semiconductor pressure sensor laminates a glass substrate to the back side of the pressure-sensitive chip, in which a piezo-resistance pressure-sensitive gauge is formed on the surface of a diaphragm made of a silicon single crystal, forms a first space between the back of the diaphragm and the glass substrate, and measures the pressure to be measured applied to the surface of the diaphragm, with the pressure of the first space as the reference pressure. The semiconductor pressure sensor comprises a projection, made of resin formed on a pressure-sensitive gauge electrode arranged on the surface of the pressure-sensitive chip; a conductive layer that is formed so that the projection made of resin is covered partially or entirely and is electrically connected to the pressure-sensitive gauge electrode; and a bump, formed so that the projection made of resin is covered partially or entirely via the conductive layer. Furthermore, the connection position between the conductive layer and the bump is set so that the resistance value of the piezo-resistance pressure-sensitive gauge is less likely to be easily affected. COPYRIGHT: (C)2007,JPO&INPIT
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