| 摘要 |
PROBLEM TO BE SOLVED: To enable a correct handling operation of an electronic component even if the positions of a socket for inspection, suction nozzle and hot plate are varied by thermal expansion. SOLUTION: The IC handler comprises: a base 2 for supporting a test head 8 having the socket 6 for inspection and a heater 9 for heating an electronic component; first and second component moving devices 3 and 4 that have the suction nozzle moving horizontally and fill the electronic component into the socket 6 for inspection; and an imaging apparatus 86 for the socket for imaging the socket 6 for inspection from the upside. The IC handler also comprises a positional displacement amount detecting means for detecting the positional displacement amount of the socket 6 for inspection, by comparing the image data of the socket 6 for inspection in a relatively low temperature state imaged by the imaging apparatus 86 with the image data of the socket 6 for inspection in a relatively high temperature state imaged by the imaging apparatus 86. The IC handler also comprises a correcting means for correcting the moving amount of the first and second component moving devices 3 and 4 by the positional displacement amount of the socket 6 for inspection detected by the positional displacement amount detecting means. COPYRIGHT: (C)2007,JPO&INPIT
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