发明名称 |
Method for providing desirable wetting and release characteristics between a mold and a polymerizable composition |
摘要 |
The present invention provides a method to reduce adhesion between a conformable region on a substrate and a pattern of a mold, which selectively comes into contact with the conformable region. The method features forming a conformable material on the substrate and contacting the conformable material with the surface. A conditioned layer is formed from the conformable material. The conditioned layer has first and second sub-portions, with the first sub-portion being solidified and the second sub-portion having a first affinity for the surface and a second affinity for the first sub-portion. The first affinity is greater than the second affinity. In this fashion, upon separation of the mold from the conditioned layer, a subset of the second sub-portion maintains contact with the mold, thereby reducing the probability that a pattern formed in the conditioned layer becomes compromised.
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申请公布号 |
US2006279024(A1) |
申请公布日期 |
2006.12.14 |
申请号 |
US20060459797 |
申请日期 |
2006.07.25 |
申请人 |
UNIVERSITY OF TEXAS SYSTEM, BOARD OF REGENTS |
发明人 |
CHOI BYUNG-JIN;XU FRANK Y.;STACEY NICHOLAS A.;TRUSKETT VAN N.;WATTS MICHAEL P. |
分类号 |
B28B7/36;B29C;B29C59/00;G03F7/00 |
主分类号 |
B28B7/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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