| 摘要 |
A semiconductor integrated circuit device has two semiconductor integrated circuit chips ( 20 and 30 ) respectively provided with a plurality of PADs ( 40 a -40 e, 41 a -41 e and 42 a -42 d), a plurality of LEADs ( 50 a -50 d) disposed around arrays of the semiconductor integrated circuit chips, and a plurality of bonding wires ( 60 a -60 e and 61 a -61 d). The plurality of bonding wires are connected so as not to straddle one semiconductor integrated circuit chip ( 30 ) and allow wiring between the PADs ( 40 a -40 e) of the other semiconductor integrated circuit chip ( 20 ) and the LEADs ( 50 a -50 d).
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