| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging device with superior positional accuracy of an imaging element in an assembled state along with superior heat radiation. SOLUTION: The imaging device includes a body-side mount 14 assembled in a main body structure 4 of a camera body 3 for supporting a photographing lens, a shutter 6 arranged along an optical axis O at the opening of the main body structure 4, an image pick-up unit 8 and the like. The image pick-up unit 8 has an imaging element fixing plate 28 supported firmly by the main body structure 4, an optical low pass filter 22, a protective glass 24, and a bare chip imaging element 26. In the imaging element 26, a non-image pick-up side surface 26c is fixed to an imaging element fixing plate 28 and the imaging element 26 is assembled with an accurate length from the surface of the body side mount 14 to an image pick-up face(photoelectric conversion face) in the direction of optical axis. In addition, the bare chip imaging element 26 is fixed by bonding to the imaging element fixing plate 28 so that its superior heat radiation is realized. COPYRIGHT: (C)2007,JPO&INPIT
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