发明名称 |
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film |
摘要 |
A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and oriented toward the carrier sheet. The upper side of the base film includes an adhesive layer with semiconductor chips fixed on it, the semiconductor chips being surrounded by deactivated regions of the adhesive layer of the film upper side.
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申请公布号 |
US2006273469(A1) |
申请公布日期 |
2006.12.07 |
申请号 |
US20060439425 |
申请日期 |
2006.05.24 |
申请人 |
BEER GOTTFRIED;BRUNNBAUER MARKUS;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD |
发明人 |
BEER GOTTFRIED;BRUNNBAUER MARKUS;ESCHER-POEPPEL IRMGARD;FUERGUT EDWARD |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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