METHOD FOR DETECTING POLISHING END IN CMP POLISHING DEVICE, CMP POLISHING DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

A spectral reflection spectrum of an object to be polished which has reached a polishing end point is acquired in advance and a spectral reflection spectrum of the polishing object is acquired during polishing. The correlation between them is made a parameter 1. On the other hand, a sum of absolute values of differences of the primary differentiation values is made a parameter 2. When the parameter 2 has become a minimum value in a range where the parameter 1 exceeds a predetermined value, a polishing is judged to have reached an end point. Thus, it is possible to provide a highly reliable polishing end detection method in a CMP polishing device.