发明名称 SMART CONDITIONER RINSE STATION
摘要 <p>A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.</p>
申请公布号 WO2006127054(A1) 申请公布日期 2006.11.30
申请号 WO2006US00736 申请日期 2006.01.10
申请人 APPLIED MATERIALS, INC.;YILMAZ, ALPAY;KARUPPIAH, LAKSHMANAN 发明人 YILMAZ, ALPAY;KARUPPIAH, LAKSHMANAN
分类号 H01L21/00;B24B37/04;B24B53/00 主分类号 H01L21/00
代理机构 代理人
主权项
地址