| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device capable of reducing the number of parents required for manufacturing a semiconductor integrated circuit device and corresponding to large needs. <P>SOLUTION: The device is formed into a structure in which memory elements such as an SRAM 9a can be selectively connected by bumps in response to the needs on a bump pad 3 provided on the top surface of an IP mixture mounting gate array section 2 as a lower side semiconductor integrated circuit board provided with a CPU 4 on a center and a gate array section 6 therearound. In this way, the IP mixture mounting gate array device 1 can be manufactured with the reduced number of parents. <P>COPYRIGHT: (C)2007,JPO&INPIT |
