发明名称 POWDER THERMAL SPRAY PROCESS AND POWDER THERMAL SPRAY DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a powder thermal spray process and a powder thermal spray device where the material to be thermal-sprayed in a pure state is stacked with thermal spray powder, and a sprayed coating having excellent adhesiveness can be formed. <P>SOLUTION: When, while relatively moving a thermal spraying gun 11 for emitting a plasma arc 15 to an almost horizontal direction and a cylinder block 1 as the material to be thermal-sprayed in such a manner that the plasma arc 15 scans the surface of a bore 2 in the cylinder block 1 as the inside of the bore 2 in the cylinder block 1 is sucked and evacuated to the lower part, powder 18 is fed to the plasma arc 15, so as to form a sprayed coating 3 on the surface of the bore 2 in the cylinder block 1, the powder 18 is fed to the lower part side of the plasma arc 15, and further, the direction to which the atmosphere for emitting the plasma arc 15 is evacuated and sucked is made into the direction same as the side to which the powder 18 is fed. The phenomenon that fumes 19 are involved in the plasma arc 15 and a heat-affected zone by the plasma arc 15 is eliminated, and the intrusion of the fumes 19 into the sprayed coating 3 can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006322049(A) 申请公布日期 2006.11.30
申请号 JP20050147054 申请日期 2005.05.19
申请人 FUJI HEAVY IND LTD 发明人 ITO EIZO
分类号 C23C4/12;B05B13/04;B05B13/06;B05C19/04 主分类号 C23C4/12
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