| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided adhesive film functioning as a film-like spacer in place of a dummy chip. SOLUTION: The adhesive film for a stack type semiconductor package has a three-layer structure in which resin layers containing a thermosetting resin and having≤100°C glass transition temperature and≤50μm thickness are laminated to both surfaces of a resin layer having≥200°C glass transition temperature and≥25μm thickness. COPYRIGHT: (C)2007,JPO&INPIT
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