| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper foil for a printed circuit board under the consideration of environmental conservation which is excellent in thermal resistance, moisture resistance (rust preventing capability) and bonding property with base materials without using hexavalent chromium. <P>SOLUTION: This copper foil 1 has a roughed plating layer 2, nickel/cobalt alloy plating layer 3, a galvanizing layer 4, a chromate treatment layer 5, and a silane coupling treatment layer 6 on a bonding surface with a base material for a printed wiring board. The chromate treatment layer 5 is configured as a rust preventing layer formed by trivalent chromium chemical conversion treatment containing 0.5 to 2.5μg/cm<SP>2</SP>of chromium converted into metallic chromium. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
