Copper material for chemical vapor deposition and process for forming thin film using the same,申请号KR20000080249-传众专利搜索

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发明名称	Copper material for chemical vapor deposition and process for forming thin film using the same
摘要
申请公布号	KR100648786(B1)	申请公布日期	2006.11.23
申请号	KR20000080249	申请日期	2000.12.22
申请人		发明人
分类号	H01L21/205;C07C45/77;C07C49/92;C07F1/08;C23C16/18;H01L21/28;H01L21/285	主分类号	H01L21/205
代理机构		代理人
主权项
地址

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