RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A rigid-flexible printed circuit board and a fabrication method thereof are provided to achieve compactness of a product where the rigid-flexible printed circuit board is used, by reducing total thickness of the rigid-flexible printed circuit board mounted with an electronic component. A flexible region includes at least one flexible film where a first circuit pattern is formed at least one plane. A rigid region includes a number of insulation layers(140) formed by intervening an extended part of the one flexible film, at a position adjacent to the flexible region. An aperture is formed on the insulation layer located at the outermost part of the rigid region and then a stepped part is formed on the surface of the rigid region.