| 摘要 |
Disclosed is a high-frequency wireless signal coupler, in which a plurality of metallic signal lines on two opposite sides of an electronic device is invested with a Teflon body, respectively. The metallic signal lines transmit a high-frequency signal through an impedance of 50 or 75 ohms at a frequency as high as 60 GHz. The coupler is also provided with an outer frame for encaging the Teflon body such that two sides of the electronic device can be securely connected to form the electronic device a unitary body.
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