| 摘要 |
PROBLEM TO BE SOLVED: To solve problems associated with a conventional art and carry out cleaning processing using one damage-removing device without causing other film formation chambers to stand by for the enhancement of throughput in semiconductor manufacturing equipment having a plurality of film formation chambers. SOLUTION: The semiconductor manufacturing equipment includes a plurality of chambers 1, 2, .... Exhaust lines 31, 32 of the individual chambers 1, 2 are connected to one damage-removing device 20. When a cleaning time has come in any chamber 1, 2, cleaning processing is carried out in the other chambers 2 and in the chamber 1 whose cleaning time has come. COPYRIGHT: (C)2007,JPO&INPIT
|
