发明名称 |
PACKAGED ACOUSTIC AND ELECTROMAGNETIC TRANSDUCER CHIPS |
摘要 |
Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device. |
申请公布号 |
EP1720794(A2) |
申请公布日期 |
2006.11.15 |
申请号 |
EP20050724161 |
申请日期 |
2005.03.01 |
申请人 |
TESSERA, INC. |
发明人 |
HUMPSTON, GILES;OSBORN, PHILIP, R.;THOMPSON, JESSE, BURL;KUBOTA, YOICHI;TSENG, CHUNG-CHUAN;BURTZLAFF, ROBERT;HABA, BELGACEM;TUCKERMAN, DAVID, B.;WARNER, MICHAEL |
分类号 |
B81B7/00;H01L23/495;H04R19/00;H04R19/04 |
主分类号 |
B81B7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|