发明名称 Wiring layout of semiconductor device and design method of the same
摘要 A semiconductor device is the semiconductor device which includes more than one field effect transistor having a gate electrode to which an electrical interconnect wire is connected and a gate insulation film with a thickness of 6.0 nm or less and which comprises a first transistor group made up of a plurality of field effect transistors that are the same in thickness of gate insulation film, a second transistor group made up of a plurality of field effect transistors that are the same in thickness of gate insulation film with the thickness of gate insulation film being less than the thickness of the gate insulation film of the first transistor group, and a semiconductor substrate on which the first and second transistor groups are mounted together in a mixed manner, wherein an antenna ratio which is a ratio of the area of a wire to the gate area of a gate electrode is such that the maximum value of the second transistor group is greater than the maximum value of the first transistor group.
申请公布号 US7135722(B2) 申请公布日期 2006.11.14
申请号 US20040865943 申请日期 2004.06.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MATSUNAGA NORIAKI;YAMAGUCHI HITOMI
分类号 G06F17/50;H01L27/10;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L21/8234;H01L23/52;H01L23/522;H01L27/02;H01L27/04;H01L27/088 主分类号 G06F17/50
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