Redundant wire bonds for increasing transducer reliability

摘要

A method and a system for using redundant wire bonds ( 24 ) for increasing the reliability of ultrasound transducers is disclosed. An ultrasound transducer assembly having an ultrasound transducer, an integrated circuit ( 20 ), a plurality of wires ( 24 ), and a plurality of bond pads is provided. The integrated circuit includes enlarged lead pads for receiving redundant wire bonds. The ultrasoundtransducer includes a plurality of bond pads configured to receive the redundant wire bonds. Connecting wires, forming signal paths, connect the enlarged lead pads with the bond pads.