| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer ceramic substrate having a reliable, three-dimensional wiring conductor without going through each process for forming a through hole in a ceramic green sheet and filling a conductive paste into the through hole. <P>SOLUTION: A conductor in a plane 13 is formed on the ceramic green sheet 11 by using the conductive paste, and then a projecting conductor 14 that should become a through conductor is formed so that it is mounted on the conductor 13 in the plane at least partially. Then, by pressing the ceramic green sheet 11 entirely in a thickness direction along with the projecting conductor 14, the projecting conductor 14 is buried into the ceramic green sheet 11 along with one portion of the conductor 13 in a plane. The processes are repeated, and a plurality of ceramic green sheets are piled up for baking, thus obtaining the multilayer ceramic substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
