| 摘要 |
A method of depositing a titanium nitride film on a substrate by reacting titanium tetrachloride with ammonia, the method being less apt to cause the corrosion of the underlying layer. Titanium tetrachloride is reacted with ammonia in a region where the rate of film deposition is determined by the feeding. Thus, a first titanium nitride layer is formed on a substrate while minimizing the corrosion of the underlying layer. Subsequently, titanium tetrachloride is reacted with ammonia in a region where the rate of film deposition is determined by the reaction. Thus, a second titanium nitride layer is formed on the first titanium nitride layer while securing satisfactory step coverage.
|
