| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenol resin capable of obtaining a cured article excellent in close adhesion with copper as a molded material, especially as a material for electric and electronic parts required to have a high performance, as represented by a semiconductor-sealing material, and excellent in molding property, heat resistance, mechanical strengths and low stress property, an epoxy resin-curing agent by using the phenol resin and an epoxy resin composition. SOLUTION: This phenol resin has a recurring unit expressed by general formula (I) [wherein, R is a compound having at least one phenolic hydroxy group in an aromatic ring] in its molecule. The epoxy resin-curing agent consisting of the phenol resin, and the epoxy resin composition containing the epoxy resin-curing agent, the epoxy resin and an inorganic filler are also provided. COPYRIGHT: (C)2007,JPO&INPIT
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