| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solid state imaging device formed into a highly airtight package. <P>SOLUTION: The solid state imaging device comprises a flat plate-shaped substrate 2, a solid state imaging element 3 mounted on this substrate 2, a frame 4 built up at the predetermined height on the substrate 2 in a fashion to surround the solid state imaging element 3, and a lid 5 which is joined to the top edge of the frame 4 with a given space kept away from a mounting plane of the solid state imaging element 3 on the substrate 2 and used for the hermetic sealing of the solid state imaging element 3 on the substrate 2 in this given space. The outer edge of the frame 4 is in inclined form so that it may broaden toward the substrate 2 from the top edge. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
