| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible metal laminate which is used in treatment for pushing a projection like a bump at high temperatures and can solve a problem caused by the contraction/deformation of a resin layer and a flexible printed circuit board using the laminate. SOLUTION: The flexible metal laminate comprises a metal layer 10 and a resin layer 11 consisting of at least two layer formed on the metal layer 10, wherein the moisture absorption coefficient (C<SB>HO</SB>) of the outermost layer (the second layer 15) of the resin layer 11 is smaller than the moisture absorption coefficient (C<SB>HM</SB>) of a layer (the first layer 14) adjoining the metal layer 10 of the resin layer 11. Also a flexible printed circuit board using the flexible metal laminate is provided. COPYRIGHT: (C)2007,JPO&INPIT
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