| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting device prevented from displacement of a semiconductor chip, when preventing the takeout of a semiconductor chip by a mounting tool. <P>SOLUTION: A mounting tool 49 possesses a main part 71 of a tool. The main part of the tool comprises a suction passage 72 formed in a tip side by arranging an opening; a first suction pump 75 for making the suction passage into negative pressure, so as to suck and hold a semiconductor chip 6 at the tip side of the main part of the tool; a pressurization pump for making the suction passage into positive pressure, so as to make the semiconductor chip secede from the tip side of the main part of the tool; an air communication passage 79 formed in a halfway position of the suction passage where one end is communicated with it, and the other end is opened to the atmosphere; and a valve unit 81 provided in the other end of the air communication passage which blockades it so as to suck and hold the semiconductor chip at the tip end when the inside of the suction passage is made into negative pressure, and suppresses the rise of pressure in the suction passage by communicating the air communication passage with the atmosphere when the inside of the suction passage is made into positive pressure. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
