| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder level detection method, a solder automatic feeder, and a solder dipping device capable of correctly detecting a change in level of a solder portion. SOLUTION: A change in level of a solder portion of a molten solder is detected according to the temperature at the reference level of the molten solder stored in a solder tank 2. Solder is fed into the solder tank according to the temperature at the reference level of the molten solder stored in the solder tank. The solder dipping device includes the solder tank to store the molten solder, the solder automatic feeder, and a temperature sensor 7 to detect the temperature at the reference level of the molten solder stored in the solder tank. COPYRIGHT: (C)2006,JPO&NCIPI
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