发明名称 Thermoelectric conversion module and electronic device
摘要 A thermoelectric conversion module includes a first insulated substrate formed in a plate shape, a second insulated substrate formed in a plate shape, the first insulated substrate and the second insulated substrate are provided so as to be paired, plural thermoelectric elements provided between the insulated substrates so as to be joined thereto, a first object joined to the first insulated substrate in a manner where the first object is cooled and a second object joined to the second insulated substrate in a manner where the second object is heated, wherein a thickness of the first insulated substrate is set on the basis of a linear expansion of the first object, and a thickness of the second insulated substrates is set on the basis of a linear expansion of the second object.
申请公布号 US2006213204(A1) 申请公布日期 2006.09.28
申请号 US20060389047 申请日期 2006.03.27
申请人 AISIN SEIKI KABUSHIKI KAISHA 发明人 MORIMOTO AKIHIRO
分类号 F25B21/02;F25D23/12 主分类号 F25B21/02
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