发明名称 FORMING METHOD OF CONDUCTIVE COMPOSITION AND CONDUCTIVE COATING FILM, AS WELL AS CONDUCTIVE COATING FILM, CONDUCTIVE CIRCUIT, AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a conductive composition and a conductive coating film with a reliable conductive circuit and migration resistance as well as a conductive coating film, a conductive circuit, and a substrate. SOLUTION: The conductive composition contains metal fine particles, and a water-soluble matter forming a stable complex with metal ion. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006260885(A) 申请公布日期 2006.09.28
申请号 JP20050074899 申请日期 2005.03.16
申请人 FUJIKURA LTD 发明人 ONO AKINOBU;NAKAMURA SHOICHIRO;SENSO TOMOMITSU;SHINODA TATSUNORI;OMORI KIWAKO
分类号 H01B1/22;H01B13/00;H05K3/12 主分类号 H01B1/22
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