发明名称 |
FORMING METHOD OF CONDUCTIVE COMPOSITION AND CONDUCTIVE COATING FILM, AS WELL AS CONDUCTIVE COATING FILM, CONDUCTIVE CIRCUIT, AND SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of a conductive composition and a conductive coating film with a reliable conductive circuit and migration resistance as well as a conductive coating film, a conductive circuit, and a substrate. SOLUTION: The conductive composition contains metal fine particles, and a water-soluble matter forming a stable complex with metal ion. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006260885(A) |
申请公布日期 |
2006.09.28 |
申请号 |
JP20050074899 |
申请日期 |
2005.03.16 |
申请人 |
FUJIKURA LTD |
发明人 |
ONO AKINOBU;NAKAMURA SHOICHIRO;SENSO TOMOMITSU;SHINODA TATSUNORI;OMORI KIWAKO |
分类号 |
H01B1/22;H01B13/00;H05K3/12 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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