发明名称 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
摘要 |
The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters ( 100 ) disposed within printed circuit boards ( 104 ). The heat sink ( 110, 200 ) is a thermal conductive material disposed within a cavity ( 102 ) of the printed circuit board ( 104 ) and is thermally coupled to a bottom surface ( 112 ) of the electrical-to-optical transmitter ( 100 ). A portion of the thermal conductive material extends approximately to an outer surface ( 120, 122 or 124 ) of a layer ( 114, 116 or 118 ) of the printed circuit board ( 104 ). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
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申请公布号 |
US7112885(B2) |
申请公布日期 |
2006.09.26 |
申请号 |
US20040888350 |
申请日期 |
2004.07.07 |
申请人 |
BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM |
发明人 |
CHEN RAY T.;CHOL CHULCHAE |
分类号 |
H01L23/24;G02B6/42;G02B6/43;H01L23/15;H01S3/04;H05K1/02 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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