发明名称 LASER HEATING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser heating apparatus capable of heating a semiconductor substrate or the like uniformly at high temperature. <P>SOLUTION: The apparatus is composed of a laser oscillator 3 which is formed by stacking a plurality of laser diode bars and an optical lens system 5 which is interposed between the laser oscillator and an object 4 to be heated. The optical lens system comprises collimator lenses 6 installed at the laser exit port of each laser diode bar in the fast axis direction of the laser oscillator 3, a convex lens 7 and a fly's eye lens 8 arranged in order toward the object to be heated. Parallel light beams from the collimator lenses are passed through the convex lens and the fly's eye lens and then, after converged, the beams are defocused and made to emit to the object 4 to be heated. In the slow axis direction of the laser oscillator 3, the laser beam from the laser exit port is shaped by a first diaphragm with the output angle unchanged and emitted to the object to be heated. Near the converging point of the optical lens system 5 in the fast axis direction of the laser oscillator, there is provided a second diaphragm 9 that transmits the laser beam. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006247696(A) 申请公布日期 2006.09.21
申请号 JP20050067408 申请日期 2005.03.10
申请人 ALFA EC CO LTD 发明人 UEMATSU TADAYUKI;CHIBA TAKASHI;TERADA MASAO;SAKAGUCHI ISAO
分类号 B23K26/073;B23K26/06;B23K101/40;H01S5/00 主分类号 B23K26/073
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