SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which the degree of freedom in secondary mounting can be enhanced by performing gap sealing for liquid resin sealing of a semiconductor chip being flip-chip mounted thereby minimizing the overall dimensions of resin projecting to the outside of the region of the semiconductor chip, and to provide its manufacturing process. SOLUTION: A metal protrusion 30 is formed simultaneously in the same process for forming the electrode protrusion 31 of a wiring board at the outside edge of sealing of a semiconductor device so that outflow of sealing resin is blocked. Overall dimensions of resin projecting to the outside of the region of the semiconductor chip 10 are minimized by performing gap sealing for liquid resin sealing of the semiconductor chip 10 being flip-chip mounted and the degree of freedom in secondary mounting can be enhanced. COPYRIGHT: (C)2006,JPO&NCIPI