Method, Device and System for Bonding a Semiconductor Element

摘要

The invention relates to a method and also a device and a system for bonding a semiconductor element ( 4 ), in which various contact areas ( 8 ) of the semiconductor element ( 4 ) are successively connected to terminal areas ( 2, 3, 7 ) by means of bonding wire elements ( 6 ) and in which an electrical variable influenced by the semiconductor element ( 4 ) is acquired during the bonding operation.