发明名称 Intergrated semiconductor component for high-frequency measurement and use thereof
摘要 It is provided that the semiconductor component is a component of a semiconductor circuit ( 10 ) comprising a first silicon layer ( 12 ), an adjoining silicon dioxide layer (insulating layer ( 14 )) and a subsequent further silicon layer (structured layer ( 16 )) (SOI wafer), and the semiconductor component comprises an IMPATT oscillator ( 30 ), having a resonator ( 24 ) which includes a metallized cylinder ( 18 ) of silicon, disposed in the structured layer ( 16 ); a coupling disk ( 28 ) covering the cylinder ( 18 ) in the region of the first layer ( 12 ); and an IMPATT diode ( 32 ), communicating with the cylinder ( 18 ) of the resonator ( 24 ) via a recess ( 38 ) in the coupling disk ( 28 ); and a reference oscillator ( 46 ) of lower frequency, having a resonator ( 24 ) which includes a metal cylinder ( 18 ) of silicon, disposed in the structured layer ( 16 ), and coupling disk ( 28 ) covering the cylinder in the region of the first layer ( 12 ); and a microwave conductor, communicating with the cylinder ( 18 ) of the resonator ( 24 ) via a recess ( 38 ) in the coupling disk ( 28 ), and the reference oscillator, via an active oscillator circuit ( 58 ), serves the purpose of frequency stabilization of the IMPATT oscillator ( 30 ); with integrated Schottky diodes; and a transmitting and receiving antenna ( 49 ).
申请公布号 US7109917(B2) 申请公布日期 2006.09.19
申请号 US20040494660 申请日期 2004.09.03
申请人 ROBERT BOSCH GMBH 发明人 SCHMIDT EWALD;PFIZENMAIER HEINZ;IRION HANS;HASCH JUERGEN
分类号 G01S7/28;H01L21/822;G01S7/03;G01S13/08;G01S13/93;H01L23/66;H01L27/04;H01L29/864;H01P7/04;H01Q9/04;H01Q19/06;H01Q23/00;H03B9/14 主分类号 G01S7/28
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