发明名称 |
TRANSFER METHOD, METHOD FOR PRODUCING TRANSFERRED BODY, METHOD FOR PRODUCING CIRCUIT BOARD, ELECTROOPTICAL DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a transfer technology in which product yield can be enhanced by reducing poor transfer. SOLUTION: The transfer method of a transferred body 10 comprises a step for forming a means 13 surrounding a transfer object region on a first substrate 1 on which one or more transferred bodies 10 are formed, a step for bonding the first substrate 1 and a second substrate 2 through an adhesive layer 3 formed by filling the transfer object region surrounded by the surrounding means 13 with adhesive, a step for removing the surrounding means 13, a step for separating the first substrate 1 and the second substrate 2 and transferring the transferred bodies 10, which are bonded to the second substrate 2 through the adhesive layer 3, to the second substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI
|
申请公布号 |
JP2006245091(A) |
申请公布日期 |
2006.09.14 |
申请号 |
JP20050055514 |
申请日期 |
2005.03.01 |
申请人 |
SEIKO EPSON CORP |
发明人 |
TAKAO HIROKI;MIYASAKA MITSUTOSHI |
分类号 |
H01L27/12;H01L21/02;H01L21/336;H01L29/786 |
主分类号 |
H01L27/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|