发明名称 TRANSFER METHOD, METHOD FOR PRODUCING TRANSFERRED BODY, METHOD FOR PRODUCING CIRCUIT BOARD, ELECTROOPTICAL DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a transfer technology in which product yield can be enhanced by reducing poor transfer. SOLUTION: The transfer method of a transferred body 10 comprises a step for forming a means 13 surrounding a transfer object region on a first substrate 1 on which one or more transferred bodies 10 are formed, a step for bonding the first substrate 1 and a second substrate 2 through an adhesive layer 3 formed by filling the transfer object region surrounded by the surrounding means 13 with adhesive, a step for removing the surrounding means 13, a step for separating the first substrate 1 and the second substrate 2 and transferring the transferred bodies 10, which are bonded to the second substrate 2 through the adhesive layer 3, to the second substrate 2. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245091(A) 申请公布日期 2006.09.14
申请号 JP20050055514 申请日期 2005.03.01
申请人 SEIKO EPSON CORP 发明人 TAKAO HIROKI;MIYASAKA MITSUTOSHI
分类号 H01L27/12;H01L21/02;H01L21/336;H01L29/786 主分类号 H01L27/12
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