| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip built-in printed circuit board which attains characteristics in high density, and compactness and flexibility by shortening connecting wire between the chip and connection line, and its manufacturing method. <P>SOLUTION: The chip built-in printed circuit board is constituted by a center layer, in which the chip is built in within a copper clad laminate (CCL) in which open region is prepared, and in which an internal layer circuit pattern is formed in an upper and lower portions of the copper clad laminate, having a via-hole for electrically connecting between the internal layer circuit pattern and the chip, an insulating layer, laminated in an upper and lower portions of the above-mentioned center layer, having the via-hole, and an outer layer circuit pattern formed on the above-mentioned insulating layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
